Searching for just a few words should be enough to get started. If you need to make more complex queries, use the tips below to guide you.
Article type: Research Article
Authors: Cortada, M. | Giner, L. | Costa, S. | Gil, F.J.; | Rodríguez, D. | Planell, J.A.
Affiliations: Departemento Ciencias Morfológicas y Odontoestomatología, Facultad de Odontología, Universidad de Barcelona, Barcelona, Spain | Departemento Ciencia de los Materiales e Ingeniería Metalúrgica, E.T.S.E.I.B., Universitat Politècnica de Catalunya, Av. Diagonal 647, 08028-Barcelona, Spain
Note: [] Corresponding author. Tel.: +34 3 4016708; Fax: +34 3 4016706; E-mail: [email protected].
Abstract: In this work the metallic ion release in oral implants with superstructures of different metals and alloys used in clinical dentistry has been determined. This study has been realized in a saliva environment at 37°C. The measurements of the ion release were carried out by means of the Inductively Coupled Plasma Mass Spectrometry technique. The titanium oral implant coupled with a chromium-nickel alloy releases a high quantity of ions and the implant coupled with the titanium superstructure presents a low value of ion release.
Keywords: Ion release, implants, metals, alloys, corrosion
DOI: 10.3233/BME-1997-7306
Journal: Bio-Medical Materials and Engineering, vol. 7, no. 3, pp. 213-220, 1997
IOS Press, Inc.
6751 Tepper Drive
Clifton, VA 20124
USA
Tel: +1 703 830 6300
Fax: +1 703 830 2300
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
IOS Press
Nieuwe Hemweg 6B
1013 BG Amsterdam
The Netherlands
Tel: +31 20 688 3355
Fax: +31 20 687 0091
[email protected]
For editorial issues, permissions, book requests, submissions and proceedings, contact the Amsterdam office [email protected]
Inspirees International (China Office)
Ciyunsi Beili 207(CapitaLand), Bld 1, 7-901
100025, Beijing
China
Free service line: 400 661 8717
Fax: +86 10 8446 7947
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
如果您在出版方面需要帮助或有任何建, 件至: [email protected]