Searching for just a few words should be enough to get started. If you need to make more complex queries, use the tips below to guide you.
Article type: Research Article
Authors: Lee, Junhee | Aoki, Hideki;
Affiliations: Department of Metallurgical Engineering, Dong-A University, Pusan South Korea | Division of Inorganic Materials, Institute for Medical and Dental Engineering, Tokyo Medical and Dental University, Tokyo, Japan
Note: [] Requests for reprints should be addressed to Prof. Hideki Aoki, Ph.D., Division of Inorganic Materials, Institute for Medical and Dental Engineering, Tokyo Medical and Dental University, 101 Tokyo, Japan.
Abstract: Hydroxyapatite (HAP)-coated metal composites were made by the dipping method. The specimen substrates were Ti plates with a thickness of 2 mm. The HAP coating was carried out in HAP-sol for 1 min by the dipping method. The concentration of HAP-sol for the coating ranged from 3.28 to 9.99 wt%. Excellent coating was observed on Ti substrate dipped once in 9.99 wt% sol. A surface pretreated with a sandblasting provided a much better coating than a smooth surface. As the concentration of sol increased, the weight change and the coating thickness increased. Above 7 wt% sol, they increased sharply.
Keywords: hydroxyapatite, dipping method, thin coating
DOI: 10.3233/BME-1995-5201
Journal: Bio-Medical Materials and Engineering, vol. 5, no. 2, pp. 49-58, 1995
IOS Press, Inc.
6751 Tepper Drive
Clifton, VA 20124
USA
Tel: +1 703 830 6300
Fax: +1 703 830 2300
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
IOS Press
Nieuwe Hemweg 6B
1013 BG Amsterdam
The Netherlands
Tel: +31 20 688 3355
Fax: +31 20 687 0091
[email protected]
For editorial issues, permissions, book requests, submissions and proceedings, contact the Amsterdam office [email protected]
Inspirees International (China Office)
Ciyunsi Beili 207(CapitaLand), Bld 1, 7-901
100025, Beijing
China
Free service line: 400 661 8717
Fax: +86 10 8446 7947
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
如果您在出版方面需要帮助或有任何建, 件至: [email protected]