Affiliations: [a] Chemnitz University of Technology, Institute for Machine Tools and Production Processes, Professorship for Forming and Joining, Chemnitz, Germany | [b] Fraunhofer Institute for Electronic Nano Systems ENAS, Technologie-Campus 3, Chemnitz, Germany
Correspondence:
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Corresponding author: Alexander Fröhlich, Institute for Machine Tools and Production Processes (IWP), Professorship for Forming and Joining, Chemnitz University of Technology, 09107 Chemnitz, Germany. Tel.: +49 371 531 38687; Fax: +49 371 531 23509; E-mail: [email protected]
Abstract: Considering the demand for low temperature bonding processes in packaging of micro-electro-mechanical systems (MEMS), such as accelerometers or micro mirrors, in this paper a method for selective and energy-efficient heating of metallic intermediate bonding layers by applying high-frequency electromagnetic fields with frequencies in the range of 1. 0 < f < 2.0 MHz is presented. Therefore, the induction heating process was modeled and analyzed by means of numerical simulation. Additionally, heating experiments were carried out by using IR thermography in order to verify the simulation results. The developed inductor shape allows almost homogeneous heating of all metallic layers with heating rates of more than ΔT∕Δt = 150 K∕s.
