Affiliations: [a] School of Mechanical and Power Engineering, East China
University of Science and Technology, Shanghai, China | [b] Department of Chemical and Materials Engineering,
University of Kentucky, Lexington, KY, USA
Correspondence:
[*]
Corresponding authors: Fuqian Yang, Department of Chemical and
Materials Engineering, University of Kentucky, Lexington, KY 40506, USA.
E-mail: [email protected]; Fu-Zhen Xuan, School of Mechanical and Power
Engineering, East China University of Science and Technology, Shanghai, China.
E-mail: [email protected]
Abstract: An analysis was made of the diffusional creep in polycrystalline
materials when subjected to simultaneous action of tensile stress and electric
current. Incorporating the contribution of electromigration to atomic diffusion
in grain boundaries, the problem of grain boundary diffusion was solved. A
simple relationship was derived between diffusional creep rate and local
electric field intensity (current density). The results showed that
electromigration can enhance the diffusional creep in polycrystalline
materials.
