Asymptotic analysis for steady mode III crack growth in a piezoelectric sandwich composite

Article type: Research Article

Authors: Zhou, Zhi_Dong^a | Nishioka, Toshihisa^{b; *}

Affiliations: [a] Department of Engineering Mechanics, Shanghai Jiaotong University, Shanghai 200240, PR China | [b] Simulation Engineering Laboratory, Department of Ocean Mechanical Engineering, Faculty of Maritime and Sciences, Kobe University, Kobe, 658-0022, Japan

Correspondence: [*] Corresponding author. Tel./Fax: +81 78 431 6268; E-mail: [email protected]

Abstract: In this paper a steady semi-infinite mode III crack growth along the midplane of a piezoelectric layer sandwiched between two identical half spaces is considered. The Fourier integral transform is used to reduce the mixed boundary value problem to the Wiener-Hopf equation by introducing an auxiliary function. The complete stress and displacement distributions along the crack line can be obtained and further the dynamic stress and electric displacement intensity factors and the energy release rate are presented in explicit form. The results show that the crack propagation speed and coupled material constants influence on the dynamic stress and electric displacement intensity factors, moreover the dynamic energy release rate is dependent on the crack propagation speed and material 2 for this geometry.

Keywords: Crack growth, dynamic field intensity factors, piezoelectric materials, sandwich composite, Wiener-Hopf equation

DOI: 10.3233/JAE-2005-696

Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 22, no. 3-4, pp. 121-132, 2005