Coupled mechanical and conductivity measurements: Damage detection

Issue title: INABIO 2004

Article type: Research Article

Authors: Yuse, Kaori^a | Dalmas, Florent^{b; c} | Flandin, Lionel^d | Cavaillé, Jean-Yves^{c; *}

Affiliations: [a] Conservatoire National des Arts et Métiers (CNAM), 2 rue Conté, 75003 Paris, France | [b] Groupe de Physique et Mécanique des Matériaux (GPM2), – ENSPG-CNRS – BP 38402 Saint Martin d'Heres, France | [c] Groupe d'Etude de Métallurgie Physique et Physique des Matériaux (GEMPPM), INSA-CNRS, 69621 Villeurbanne cedex, France | [d] Centre de Recherche sur les Macromolécules Végétales (CERMAV), CNRS, BP 38402 St Martin d'Heres

Correspondence: [*] Corresponding author. Tel.: +33 4 72 43 83 82; Fax: +33 4 72 43 85 28; E-mail: [email protected]

Abstract: This paper reports in situ measurements of electrical resistivity during mechanical solicitation of insulator-conductor composite. Electrical and mechanical behaviors will be discussed on 3 examples namely (i) unidirectional carbon fiber reinforced polymers (CFRP), (ii) stick-like whiskers reinforced soft thermoplastics and (iii) carbon nanotubes reinforced soft thermoplastics. Resistivity measurements are described as a useful tool to monitor the damage of these composites. In the case of composite materials consisting in reinforced insulated matrix by electrically conducting fibers or fillers, resistivity (or conductivity) measurements show classically several features such as strong anisotropy in long fiber composites or the existence of continuous direct current (DC) conducting pathway for short fiber or particulate composites. Moreover, and this is the topic discussed here, in terms of mechanical stress/strain properties, the fibers or fillers conducting network may exhibit resistivity changes due to fiber ruptures, delamination, filler-filler debonding within filler network, etc.

Keywords: non destructive testing, delamination, percolation, electrical conductivity, dielectric measurements, nanocomposites

DOI: 10.3233/JAE-2005-683

Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 21, no. 3-4, pp. 183-192, 2005