Numerical and experimental study of electromagnetic-thermal coupling for electromagnetic shaker

Issue title: Proceedings from the 16th International Symposium on Applied Electromagnetics and Mechanics (ISEM 2013)

Guest editors: Xavier Maldague and Toshiyuki Takagi

Article type: Research Article

Authors: Wu, Yongxiang^a | Yang, Baokun^a | Liu, Zhen^a | Wang, Cheng^b | Dong, Longlei^{a; *}

Affiliations: [a] State Key Laboratory for Strength and Vibration, Xi'an Jiaotong University, Xi'an, Shaanxi, China | [b] College of Computer Science and Technology, Huaqiao University, Xiamen, Fujiang, China | Université Laval, Canada | Tohoku University, Japan

Correspondence: [*] Corresponding author: Longlei Dong, School of Aerospace, Xi'an Jiaotong University, 28 West Xianning Road, Xi'an 710049, Shaanxi, China. E-mail: [email protected]

Abstract: In combining infrared (IR) thermography and the finite element method (FEM), a method is proposed for electromagnetic-thermal coupling analysis of an electromagnetic shaker armature assembly. IR thermography is used to obtain the temperature field of the armature assembly. Based on the lumped capacitance principle, this temperature field is then used to determine local convective heat transfer coefficients. FEM analysis of electromagnetic-thermal coupling is then performed using the obtained coefficients. The validity of this method is demonstrated by comparing measured and calculated transient temperature fields.

Keywords: Infrared thermography, electromagnetic shaker, local convective heat transfer coefficient

DOI: 10.3233/JAE-141814

Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 45, no. 1-4, pp. 69-74, 2014