Affiliations: [a] Department of Materials Science and Engineering,
College of Materials, Xiamen University, Xiamen, Fujian, China | [b] College of Civil Engineering, Nantong University,
Nantong, Jiangsu, China | [c] Fujian Provincial Key Laboratory of Advanced
Materials, Xiamen University, Xiamen, Fujian, China
Correspondence:
[*]
Corresponding author: Zhi-Dong Zhou, Department of Materials
Science and Engineering, College of Materials, Xiamen University, Xiamen
361005, Fujian, China. E-mail: [email protected]
Abstract: A thin stiff film subjected a compressive force on a compliant
substrate can form wrinkles. Buckling stiff piezoelectric thin films hold great
applications for micro- and nano-electromechanical systems. The present study
focuses on the buckling process of a piezoelectric thin film bonded to a
compliant layer, which in turn lies on a rigid support. Nonlinear
electromechanical equations for the buckling of a thin piezoelectric plate are
employed to model the piezoelectric film poled in the thickness direction. By
solving the boundary value problem, the critical buckling condition and the
wavelength of the buckles for substrates of various moduli and the thicknesses
are obtained and discussed. The effect of piezoelectricity on the critical
buckling condition of piezoelectric film is examined. It is found that the
piezoelectricity has a stiffening effect, which is not negligible.
