Searching for just a few words should be enough to get started. If you need to make more complex queries, use the tips below to guide you.
Article type: Research Article
Authors: Sinclair, R. | Tan, K.T.W. | Preuss, M. | Withers, P.J.
Affiliations: Manchester Materials Science Centre, University of Manchester, Grosvenor Street, Manchester M1 7HS, UK
Note: [] Corresponding author. Fax: +44-161-200-3586. E-mail: [email protected]
Abstract: High resolution synchrotron microtomography and strain mapping of individual fibres were performed at the ESRF, Grenoble, France. In this manner, the strain distributions along individual fibres have been measured in relation to matrix and fibre cracking for a fatigue cracked Ti/SiC fibre composite specimen. The interfacial shear stress distributions in the bridging fibres were derived from the fibre strains. These indicate how the extent of debonding decreases from the notch towards the crack tip. The debonding behaviour was modelled using a partial debonding shear lag model. Upon unloading the sliding of the debonded regions reversed leading to fretting wear and an associated reduction in interface shear strength near the crack relative to monotonic loading tests.
Keywords: Metal matrix composite, Fatigue crack growth, Fibre bridging, Interfacial shear stress
DOI: 10.1080/10238160410001734676
Journal: Journal of Neutron Research, vol. 12, no. 1-3, pp. 195-199, 2004
IOS Press, Inc.
6751 Tepper Drive
Clifton, VA 20124
USA
Tel: +1 703 830 6300
Fax: +1 703 830 2300
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
IOS Press
Nieuwe Hemweg 6B
1013 BG Amsterdam
The Netherlands
Tel: +31 20 688 3355
Fax: +31 20 687 0091
[email protected]
For editorial issues, permissions, book requests, submissions and proceedings, contact the Amsterdam office [email protected]
Inspirees International (China Office)
Ciyunsi Beili 207(CapitaLand), Bld 1, 7-901
100025, Beijing
China
Free service line: 400 661 8717
Fax: +86 10 8446 7947
[email protected]
For editorial issues, like the status of your submitted paper or proposals, write to [email protected]
如果您在出版方面需要帮助或有任何建, 件至: [email protected]