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Article type: Research Article
Authors: Gou, Hongyuana; b | Zhang, Xianyonga; b; *
Affiliations: [a] School of Mathematical Sciences, Sichuan Normal University, Chengdu, China | [b] Institute of Intelligent Information and Quantum Information, Sichuan Normal University, Chengdu, China
Correspondence: [*] Corresponding author. Xianyong Zhang, E-mail: [email protected].
Abstract: The multi-granulation rough sets serve as important hierarchical models for intelligent systems. However, their mainstream optimistic and pessimistic models are respectively too loose and strict, and this defect becomes especially serious in hierarchical processing on an attribute-expansion sequence. Aiming at the attribute-addition chain, compromised multi-granulation rough set models are proposed to systematically complement and balance the optimistic and pessimistic models. According to the knowledge refinement and measure order induced by the attribute-enlargement sequence, the basic measurement positioning and corresponding pointer labeling based on equilibrium statistics are used, and thus we construct four types of compromised models at three levels of knowledge, approximation, and accuracy. At the knowledge level, the median positioning of ordered granulations derives Compromised-Model 1; at the approximation level, the average positioning of approximation cardinalities is performed, and thus the separation and integration of dual approximations respectively generate Compromised-Models 2 and 3; at the accuracy level, the average positioning of applied accuracies yields Compromised-Model 4. Compromised-Models 1–4 adopt distinctive cognitive levels and statistical perspectives to improve and perfect the multi-granulation rough sets, and their properties and effectiveness are finally verified by information systems and data experiments.
Keywords: Multi-granulation rough set, statistical compromised modeling, attribute-addition chain, granular computing, tri-level analysis
DOI: 10.3233/JIFS-200708
Journal: Journal of Intelligent & Fuzzy Systems, vol. 40, no. 1, pp. 715-732, 2021
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