Diffraction Stress Analysis in Thin Films and Coatings—Problems, Methods and Perspectives

Article type: Research Article

Authors: Genzel, CH.

Affiliations: Hahn-Meitner-Institut Berlin c/o BESSY II, Department of Structural Research, Albert-Einstein-Str. 15, D-12489 Berlin, Germany

Note: [] E-mail: [email protected]

Abstract: X-ray stress analysis (XSA) at polycrystalline materials is usually a very time-consuming and demanding procedure. This especially applies to thin films and coatings with strong texture and/or steep residual stress gradients, the investigation of which is an important topic in modern materials science research, because these stresses are well-known to influence the properties of technical parts and electronic devices. Starting from some basic aspects concerning the possible residual stress states in thin layers, the paper is to give a compact survey of some of the most important problems in thin film stress analysis and the attempts at their solution.

Keywords: Thin films, Residual stress, Texture, X-ray diffraction

DOI: 10.1080/10238160410001734739

Journal: Journal of Neutron Research, vol. 12, no. 1-3, pp. 233-241, 2004