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Article type: Research Article
Authors: Keswani, Vinay H.a; * | Peshwe, Paritoshb
Affiliations: [a] Department of Electronics and Telecommunication Engineering, G H Raisoni College of Engineering, Nagpur, India | [b] Department of Electronics and Communication Engineering, Indian Institute of Information Technology, Nagpur, India
Correspondence: [*] Corresponding author. Vinay H. Keswani, Department of Electronics and Telecommunication Engineering, G H Raisoni College of Engineering, Nagpur, India. E-mail: [email protected].
Abstract: This paper presents the design of a novel multiparametric model aimed at improving sub-field scheduling performance for lithographic processes. The proposed model incorporates various parameters such as sub-field locations, conflict analysis, critical dimensions, delay, current, voltage, dose, and depth of current for optimization of scheduling operations. To achieve this, we have utilized both Genetic Algorithm (GA) and Q-learning algorithms to optimize the scheduling performance in real-time lithographic processes. The need for this work stems from the increasing demand for high precision lithographic processes, which require efficient scheduling operations to achieve optimal results. The proposed model has been tested on real-time lithographic processes, and the results have been evaluated in terms of critical dimensions, scheduling performance, and scheduling efficiency. The results show that the proposed model has reduced critical dimensions by 8.5%, improved scheduling performance by 10.5%, and increased scheduling efficiency by 8.3% . These results demonstrate the efficacy of the proposed model in improving sub-field scheduling performance in lithographic processes. Based on the results it can be observed that this work presents a novel multiparametric model that utilizes GA and Q-learning algorithms to improve sub-field scheduling performance in lithographic processes.
Keywords: Efficient, multiparametric, sub-field scheduling, GA, Q-Learning, optimizations
DOI: 10.3233/JIFS-233784
Journal: Journal of Intelligent & Fuzzy Systems, vol. Pre-press, no. Pre-press, pp. 1-14, 2024
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