Affiliations: [a] College of Computer Science and Artificial Intelligence, Wenzhou University, Wenzhou, Zhejiang, China | [b] Xinjiang Institute of Technology, Akesu, Xingjiang, China
Correspondence:
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Corresponding author: Yi Wan, College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou, Zhejiang 325035, China. E-mail: [email protected].
Abstract: PCB is an important component for electronic devices – Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB’s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.
